ELITE THERMAL CONDUCTIVITY – The Cooler Master Thermal Pad Pro features nano diamond particles for premium thermal conductivity (15.3 W/mK) to help rapidly cool PC components
NON-TOXIC, NON-CORROSIVE & ELECTRICALLY INSULATED – The pads are safe to handle, heat resistant, and are non-corrosive to metal components; There is no risk of electrical transmission through the pads as they are electrically non-conductive
SECURE DOUBLE-SIDED ADHESIVE – The Thermal Pad Pro employs a double-sided adhesive in order to provide secure and seamless contact between the surfaces of targeted components
EASY APPLICATION – The Cooler Master Thermal Pad Pro can be easily cut and tailored to the perfect size for a simple & clean application
EXCELLENT COMPATIBILITY – The Thermal Pad Pro can be applied on a wide range of components, such as motherboards, CPUs, GPUs, USICS, hard drives, disk drives, IGBT modules, laptops, and other electronics to improve performance
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