Thermal Pad 0.5mm

R0

Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling.

Out of stock

SKU: TPX-NOPP-9005-R1 Categories: ,
Description

Formulated with Nano Elements – Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3w/mK for rapid cooling, suitable for a wide range of electronics and devices. 

Non-toxic and Non-corrosive – Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening

Double-sided Adhesive – Provides seamless and secure contact between surfaces

Versatile and Easy Application – Easily cut to the perfect size for your application

Additional information
Weight 0,019 kg
Dimensions 8,2 × 17 × 3 cm

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