Unparalleled Hardware & Cooling Capabilities
Mammoth Water Cooling Support
Exclusive Tool-Less Technology
ARGB Gen2 ready with MasterPlus+ integration
IN SPIRIT OF COOLER MASTER’S HAF LEGACY
HARDWARE & CONNECTIVITY
The front I/O is designed to maximize the front connectivity for most high end motherboards, featuring four USB Gen 3.1 Type A ports, a USB Gen 3.2 Type C, a 4 pin audio/mic headset jack as well as a dedicated mic jack.
MAMMOTH RADIATOR SUPPORT
480mm: Side Panel *1
360mm: Front Panel *1 or Bottom Panel *1 / Top Panel *2
240mm: Rear Panel *1
ADVANCED MOUNTING OPTIONS
The unique removable top panel design allows you to effortlessly install, reach and maintain cooling components such as fans and radiators even in builds with complex custom cooling systems.
This, coupled with the rotatable radiator/fan bracket included out of the box allows for an unparalleled building experience.
EXCLUSIVE 200MM SICKLEFLOW ARGB PWM PERFORMANCE EDITION
HAF 700 comes with dual exclusive 200mm Sickleflow ARGB PWM “Performance Edition” fans tailored to strike a balance between performance potential and noise levels.
INTEGRATED 7X PWM & 5X ARGB HUB
A-RGB GEN2 FEATURES
ARGB GEN2 READY, CONTROLLER INCLUDED
ARGB Gen2 technology allows users to explore full range customization down to the lighting effecting of each individual LED, while remaining compatible with third party devices.
MASTERPLUS+ SOFTWARE INTEGRATION
HAF 700 comes equipped with a software suite in MasterPlus+, facilitating user-friendly management and customization of the integrated ARGB Gen2 controller (A1).
The A1 controller plugin will automatically be activated on MasterPlus+ once the controller has been connected to the system.
UNRESTRICTED FRONT PANEL INTAKE
HAF 700 sports a fully meshed front panel, specifically designed to allow for maximum air intake.
With the front panel structurally reinforced to prevent resonation caused by fan vibrations, systems can run smoothly at minimal noise levels.
MULTI CHAMBER LAYOUT
HAF 700’s structure segregates non heat sensitive components so heat dissipation can be targeted towards heat sensitive components at an overall higher efficiency.